Product Name: Electronic device heat sink
Usage scenario:
1. Aluminum extruded radiators are commonly used in low-power electronic devices.
2. The combination of a fan and a finned heat sink is commonly used for PC CPUs/GPUs, industrial motors, and power modules.
3. Liquid-cooled radiators are commonly used in high-performance PCs, overclocked CPUs, and small servers
4. Heat pipe radiators are commonly used in laptops, compact devices (such as drone flight controllers), and communication base stations
Process characteristics:
1. Various process types: aluminum extrusion, die casting, CNC, friction stir welding, shovel tooth, cold forging, reflow soldering, anodizing, spraying, etc
2. High quality requirements: phased array inspection, high and low pressure air tightness inspection, helium inspection, cleanliness inspection, flow resistance inspection, and thermal performance inspection.